The Quantum DIMM: A Coaxial 3D-Stacked Architecture for Scalable Silicon Quantum Computing
Abstract
Abstract The scalability of silicon-based quantum computers is fundamentally limited by the electromagnetic density of control interfaces—the “Wiring Wall.” While recent breakthroughs have demonstrated high-fidelity spin qubit operation at temperatures above 1 K [22], enabling the co-integration of qubits with cryo-CMOS logic, the geometry of 2D planar architectures remains a bottleneck for megabyte-scale integration. We present the “Quantum DIMM,” a 3D-stacked architecture that leverages standard commercial Through-Silicon Vias (TSVs) to vertically integrate control electronics directly beneath the qubit layer. Using a multi-physics simulation framework, we demonstrate that a 10 µm amorphous SiO2 interposer acts as a thermal “one-way valve” (κSi/κSiO2 ≈ 6000), maintaining qubit temperatures within 1.3 mK of the heat sink even under 5 W of active power dissipation. Furthermore, we show that by optimizing the TSV geometry for 50 Ω impedance matching, the grounded coaxial shell suppresses electromagnetic crosstalk by-140 dB. Integrating the dominant magnetic flux noise from surface spins (mitigated by α-Si passivation), this architecture achieves a robust coherence time of T2 ≈ 68.2 ms for 31P nuclear spins, combining the manufacturability of 3D-stacked memory with the coherence required for fault-tolerant quantum computing.
Read the paper
Related studies
- In silico toxicology protocols
- QM7-X, a comprehensive dataset of quantum-mechanical properties spanning the chemical space of small organic molecules
- Quantum Informed Machine-Learning Potentials for Molecular Dynamics Simulations of CO2's Chemisorption and Diffusion in Mg-MOF-74
- In-silico strategies in nano-drug design: Bridging nanomaterials and pharmacological applications
- mRNA codon optimization with quantum computers
- The computational power of the human brain
Go deeper in Evidence Hub
Evidence Hub adds a study data sheet (design, sample size, evidence level, key numbers), an AI summary and a chat grounded in the paper's text.